Semiconductor Research Corporation (SRC): White Papers
| Name: |
Semiconductor Research Corporation (SRC): White Papers Application deadline: 07/05/24 |
|---|---|
| General description: |
Nanomanufacturing Materials and Processes (NMP): 3D Heterogenous Integration Back End Processes Front End Processes 3D Monolithic IntegrationMetrologyPatterning Photonics Funding: $135K/year, for 3 years. For more details: https://src.secure-platform.com/a/page/NMP-needs https://src.secure-platform.com/a/page/GetFunded/nmp Packaging (PKG): Design Enablement and Tools Interconnects, including photonics Power Delivery and Thermal Management Metrology, Modeling, and Test Materials including Solder and Wire-bonds Funding: $105K/year, for 3 years. For more details: https://src.secure-platform.com/a/page/PKG-needs https://src.secure-platform.com/a/page/GetFunded/pkg#Research%20Needs Due to the agency`s IP policy, research proposals must be approved by the legal department before submission. Please contact us if considering the application. |
| Source: | Foreign |
| Contact person: | Robi, 2152, robertg@trdf.technion.ac.il; iris 1272, irisbr@technion.ac.il; Luba, lubak@technion.ac.il |
| Fields: | Exact sciences and IT Field |
| Type of fund: | The fund is not a competitive fund |
| Related fund and profiles: | Semiconductor Research Corporation - SRC ,Access available for Technion staff. Please sign in to see the Agency profiles (upper left corner) |