Semiconductor Research Corporation: Packaging – White papers
| Name: |
Semiconductor Research Corporation: Packaging – White papers Application deadline: 13/04/15 |
|---|---|
| General description: |
The packaging thrust area of SRC is soliciting white papers in the area of micro-electronics packaging (details available in link below). Successful white paper authors will be invited to submit full proposals. Funding $85K-$100K per yr for 2 to 3 yrs.
|
| Source: | Foreign |
| Budget: | Funding $85K-$100K per yr for 2 to 3 yrs. |
| Number of research years: | 2-3 |
| Contact person: | Robi, 2152, robertg@trdf.technion.ac.il; Michal, 1745, michall@trdf.technion.ac.il |
| Fields: | Exact sciences and IT Field |
| Type of fund: | The fund is not a competitive fund |
| Related fund and profiles: | Semiconductor Research Corporation - SRC ,Access available for Technion staff. Please sign in to see the Agency profiles (upper left corner) |